Thursday, June 10, 2010

Reference of Electroplating Process

If you need more reference of the Electroplating Process, you can learn from the list of references below:

1.      W.H. Safrenek. F.B. Dahle, and C.L. Faust, Plating, 35, 39 – 1945, “Application of Nickel”, Materials Advisory Board, National Research Council Publ. MAB-245, Washington, D.C., Dee, 1968, reprinted on March 1968.
2.      G. Dubpernell, Plating, 46, 599 (1959)
3.      I. Adams, Trans, Am. Electrochem, Soc. 9, 211 (1906)
4.      I. Adams, U.S. Patent 93, 157 (1869)
5.      I. Adams, U.S. Patents 102, 784 (1870); 113, 612 (1871)
6.      W. H. Remington, U.S. Patent 82, 877 (1865)
7.      O.P. Watts, Trans, Am. Electrochem, Sec. 23, 99 (1913)
8.      E. Weston, U.S. Patent 211, 071 (1879)
9.      W.D. Baneroft. Trans. Am. Electrhochem sec. 9,218 (1906)
10.  O.P. Watts, Trans. Am. Electrochem, Sec. 29, 395 (1916)
11.  O.P. Watts and P.L. DeVerter, Trans. Am. Electrochem, Sec. 30, 145 (1916)
12.  M.R. Thompson, Trans Am, Electrochem. Sec. 41, 333 (1922)
13.  W.M. Phillips, Trans. Am Electrochem. Sec. 38, 387 (1930)
14.  M. Schlotter, U.S. Patent 1, 972, 693 (1934)
15.  E.B. Saubestre, Plating, 45, 927 (1958); T.P. Hoar, Trans, Inst. Met. Finish, 39, 166 (1962)
16.  W.A. Wesley and E.J. Roehl. Trans, Electrochem. Sec., 86, 419 (1944)
17.  W.A. Wesley and J.W. Carey, Trans. Electrochem, Sec 73, 209 (1939)
18.  W.L. Pinner and R.B. Kinnaman, Mon. Rev. Am. Electroplat. Sec., 32, 227 (1945)
19.  A.K. Graham. S. Heiman, and H.J. Read, Proc. Am. Electroplat. Sec., 27, 95 (1939); O.O. Schauss, R.J. Gale, and W.H. Gauvin, Plating, 58, 901 (1971)
20.  D.J. Macnughtan, Mon. Rev. Am. Electroplat. Sec., 22(7), 49 (1935)
21.  W. Blum and C. Kasper, Trans, Faraday Sec., 31, 1203 (1935)
22.  G. U. Greene, Trans., Electrochem, Sec., 76,391 (1939)
23.  A. Brenner. V. Zentner, and C.W. Jennings, Plating, 39, 565 (1952; A. Brenner, Electrodeposition of Alloys, Vol. II, Academic Press, New York, 1963, p. 246.