The deposits with a low electrical resistivity were obtained in copper flouroborate and sulfate baths at 30oC, which contained no addition agents. These deposits also were thermally stable to 400oC, changed very little in density, and exhibited low stress, less than 3.0 kg/cm2. The properties for the good-leveling copper were measured for specimens deposits in a copper sulfate bath containing a sulfonate compound and the operating conditions on the properties and structure of copper electrodeposits is described in reference.
The grain structure of copper deposits usually correspond to one of four types. Deposits from the sulfate baths containing no addition agents are columnar. Additions of gelatin, phenolsulfonic and many other agents cause the fibrous structure.
Properties of copper electrodeposited: